high performance materials, thermal stress tests and cross section analysis.
AOI (Automated Optical Inspecion).
Flying Probe Electrical Test.
- Via in pad: plated vias located on SMDs pads, can be filled and surface plated.
- Blind via: plated vias connecting one external layer to inner layers.
- Buried via: plated vias connecting only inner layers.
Edge and slot plated:
Cavities: openings in the PCB to allow access to inner layers.
Groove: different thicknesses in the same board.
Countersink, plated or not:
Controlled impedance: Continuous testing – Records with lines down to 2 mils.
TDR testing
Antennas and RF: Fabrication of boards for RF application, micro-wave: special substrates, hybrid stackups.
Flex (FPCB): Coverlay, flex soldermask, stiffener, double sided tape
Fabrication of flex circuits (FPCB): flex to install and/or function.
Rigid-flex: Fabrication of rigid-flex PCBs: flex to install and/or functionality
Exotic substrates: PTFE boards (Rogers RO3000 series, Diclad, Cuclad): boards with PTH.
Backdrilling: partial removal of plating in vias to required layer for improved electrical signal integrity in high speed circuits.
Castellated vias: PTH at the board edges, for use in board-on-board or specific connectors.
Landless via: vias fabricated without lands, allowing higher density of conductors.
