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Standard |
Advanced |
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Materials |
FR4 150 Tg, High Tg (180 Tg) laminates and prepregs, Rogers RO4000 series, Polyimide (flex), Panasonic MEG4 and MEG6 |
Al-MCPCB (metalcore), PTFE (Rogers RO3000 series, Diclad, Cuclad), Polyimide (rigid). |
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Panel size |
18"x24" |
18”x12” |
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Multilayer |
Up to 24 layers |
30 layers |
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Blind via |
✔ | ✔ |
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Via in pad |
✔ | ✔ |
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Buried via |
✔ | ✔ |
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Cavity |
✔ | ✔ |
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Rigid-Flex |
✔ | ✔ |
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Min. innerlayer thickness |
0,075mm (3 mils) |
0,050mm (2 mils) |
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Min. dielectric thickness |
0,075mm (3 mils) |
0,050mm (2 mils) |
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Max./Min. total thickness |
0,1 / 5,0 mm |
on request |
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X-ray registration |
✔ | ✔ |
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Drilling |
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Min. mechanical hole diameter |
0,15 mm |
= |
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Max. mechanical hole diameter |
6,35 mm |
= |
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Min. PTH diameter |
0,10 mm |
= |
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Controlled depth drilling |
0,10 mm |
= |
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Backdrilling |
✔ |
= |
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Stacked vias |
✔ | = |
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Castellated vias |
✔ |
= |
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Landless vias |
✔ | = |
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“Aspect ratio” |
12:01 |
15:01 |
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Max. Copper Plating Thickness |
Up to 6 Oz |
+ on request |
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Image |
Direct Imaging (Laser Direct Imaging) |
= |
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Semi aut. exposure units with CCD registration. |
= |
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Min. line-space (inner and outerlayer) |
0,075mm (3 mils) |
0,050 mm (2 mils) |
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Min. BGA pitch |
0,36 mm |
= |
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Solder resist |
Electra solder resist, flexible resist. Solder out. |
= |
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Surface finishing (RoHS compliant) |
ENIG, automatic line. |
= |
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OSP |
= |
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Electrical Test |
Flying probe, 5000 tps/min |
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Min. pitch 4 mils |
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Min. pad 2 mils |
= |