|
Standard |
Advanced |
Materials |
FR4 150 Tg, High Tg (180 Tg) laminates and prepregs, Rogers RO4000 series, Polyimide (flex), Panasonic MEG4 and MEG6 |
Al-MCPCB (Bergquist), PTFE (Rogers RO3000 series, Diclad, Cuclad) |
Panel size |
18"x24" |
18”x12” |
Multilayer |
Up to 24 layers |
30 layers |
Blind via |
✔ | ✔ |
Via in pad |
✔ | ✔ |
Buried via |
✔ | ✔ |
Cavity |
- |
✔ |
Rigid-Flex |
- |
✔ |
Min. innerlayer thickness |
0,075mm (3 mils) |
0,050mm (2 mils) |
Min. dielectric thickness |
0,075mm (3 mils) |
0,050mm (2 mils) |
Max./Min. total thickness |
0,1 / 5,0 mm |
on request |
X-ray registration |
✔ | ✔ |
Drilling |
|
|
Min. mechanical hole diameter |
0,15 mm |
= |
Max. mechanical hole diameter |
6,35 mm |
= |
Min. PTH diameter |
0,10 mm |
= |
Controlled depth drilling |
0,10 mm |
= |
Stacked vias |
- |
✔ |
Castellated vias |
✔ |
= |
Landless vias |
- |
✔ |
“Aspect ratio” |
12:01 |
15:01 |
Max. Copper Plating Thickness |
Up to 4Oz |
+ on request |
Image |
Semi aut. exposure units with CCD registration. |
= |
Up to 15 microns positioning accuracy. |
= |
|
Min. line-space (inner and outerlayer) |
0,075mm (3 mils) |
0,050 mm (2 mils) |
Min. BGA pitch |
0,4 mm |
= |
Solder resist |
Electra solder resist, flexible resist. Solder out. |
= |
Surface finishing
|
ENIG, automatic line.. |
= |
Electrical Test |
Flying probe, 5000 tps/min |
|
Min. pitch 4 mils |
|
|
Min. pad 2 mils |
= |